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:: Volume 9, Issue 3 (Res Dent Sci 2012) ::
J Res Dent Sci 2012, 9(3): 140-145 Back to browse issues page
Comparison of Beam Hardening Artifacts in Dental Implant Scans Made by CBCT Versus CT
Farzad Esmaeili , Masoume Johari , Pezhman Haddadi *
Dental School of Gyuilan University of Medical Sciences, Rasht, Iran , pejman_phm@yahoo.com
Abstract:   (19576 Views)

  Abstract:

 

  Background and Aim : Cone beam computed tomography (CBCT) is an alternative to a CT scan in dental treatments. Metals used in dentistry may cause production of artifacts due to beam hardening phenomenon. The aim of this study was to compare the beam hardening artifacts produced in New Tom VG, PlanmecaPromax 3D, Max and Somatom Sensation 64-Slice CT.

  Materials and Methods: In this descriptive study an implant drilling model was used [IMP 1003-L-HD].The implants (Dentis) were placed in the canine, premolar and molar areas. The identical images were evaluated by two radiologists. The number of artifacts in each image was determined using the scale provide due to reference books Kruskal-Wallis test was used to compare mean values of data.

  Results: NewTom VG had the maximum resolution (4.53±0.48) and PlanmecaPromax had the lowest resolution. (1.8±0.84). The results showed significant difference between the three Scanners (P<0.001).

  Conclusion: Given the high quality of the images produced by NewTom VG and the lower exposure dosesand costs in comparison to CT, the use of this scanner in dental procedures is recommended, especially in patients with extensive restorations, multiple prostheses and previous implants.

 

Keywords: Computed tomography; Cone Beam; Artifact; Dental implant.
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Type of Study: original article | Subject: oral surgery
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Esmaeili F, Johari M, Haddadi P. Comparison of Beam Hardening Artifacts in Dental Implant Scans Made by CBCT Versus CT. J Res Dent Sci 2012; 9 (3) :140-145
URL: http://jrds.ir/article-1-216-en.html


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Volume 9, Issue 3 (Res Dent Sci 2012) Back to browse issues page
مجله تحقیق در علوم دندانپزشکی Res Dent Sci
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